| |
|
|
| |
|
 |
 |
| |
 |
Evaluation of Technology and New equipments
|
| - |
The overall coverage for patents will toward technology development of crystallization and slicing process. |
| - |
Crystallization control for high conversion efficiency solar wafers. |
| - |
More innovation in cutting process technology for thin wafer slicing. |
Optimization of production flow
|
| - |
The production flow control on crucible coating. |
| - |
The stablization of crystallization process control. |
New material research and development
|
| - |
The characteristics and usage control of slurry and cutting material. |
| - |
The recycling usage of cutting slurry and wires. |
|
 |
|
|
|
| |
|
|
